Olympus Soft Imaging Solutions

	iTEM Family
	iTEM Platform iTEM CE iTEM Desktop archive FDA webRacer siViewer
	iTEM Solutions
	ASAC EFTEM Diffraction Tomography telePresence Detection EMarker
	Side-mounted TEM cameras
	Veleta MegaView III Morada
	Bottom-mounted TEM cameras
	KeenView Cantega G2
	Digital Scan Interface

The iTEM Solution ASAC (Automatic Strain Analysis by CBED) is an advanced tool for the TEM/CBED field and is for use with Olympus Soft Imaging Solutions' TEM imaging platform iTEM.

Key Features

Specifications

Applications

	Computation of HOLZ pattern models
	Computation of strain tensor and its trace with a precision of 2x10-4 for single TEM/CBED images and image series
	Automatic image processing, line detection and line indexing for the entire image stack

The iTEM Solution ASAC (Automatic Strain Analysis by CBED) is an advanced tool for the TEM/CBED field and is for use with Olympus Soft Imaging Solutions TEM imaging platform iTEM. It automatically determines the strain in silicon devices using image analysis. Convergent beam diffraction TEM images of Silicon (Si) <130> at 100 kV, <230> and <430> at 200 kV can be analyzed using ASAC. The algorithm detects the HOLZ (High Ordered Laue Zone) lines automatically with a high degree of precision. The iTEM Solution ASAC calculates the effective voltage, the strain tensor and its trace at the click of a button. The strain values can be visualized as a colored spot within an overview image or exported as a data sheet. Using the iTEM Solution ASAC means that a series of images of a semiconductor structure can be analyzed within a very short time.