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Automatic calliper tool for object structures
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Determines coordinates, intercepts, angles, radii and distances
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Automatic execution of recurring measurement
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Line width measurements on semiconductor structures
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Statistical evaluation of critical dimensions (CD)
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Thickness of single or multiple layers of cross-sectional samples
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The Scandium Solution Metrology is comprised of special functions for automatically measuring object structures. An automatic caliper tool is for fully automatic execution of recurring measurement processes and dimensioning on images. It detects edges within an image and determines coordinates, intercepts, angles, radii and distances based on this information. The geometrical elements thus determined can be linked to further measurement rules. Any shifts of measurement objects within an image are recognized as such during measurement and corrected automatically. Critical dimensions (CD) on semiconductor structures can be measured using the line width functions. Numerous statistical evaluation algorithms assist evaluation of results. This means the SEM is transformed into a wafer measurement system. The thickness of single or multiple layers of cross-sectional samples can be measured using the layer thickness functions – either interactively or automatically. It measures layer thicknesses either perpendicular to neutral fibers or via the shortest distance. Layer boundaries may be specified via line segments, polygons, freehand polygons, curved lines or via particle boundaries – in combination with the Scandium Solution Detection.
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